Power chips are attached to outside circuits with packaging, and their performance depends on the assistance of the product packaging. In high-power circumstances, power chips are generally packaged as power modules. Chip interconnection refers to the electrical link on the upper surface area of the chip, which is typically light weight aluminum bonding cable in traditional modules. ^
Traditional power module plan cross-section
Today, industrial silicon carbide power modules still mainly use the packaging modern technology of this wire-bonded traditional silicon IGBT module. They deal with troubles such as big high-frequency parasitic specifications, not enough warmth dissipation ability, low-temperature resistance, and not enough insulation strength, which restrict using silicon carbide semiconductors. The display screen of exceptional performance. In order to resolve these troubles and fully manipulate the substantial possible benefits of silicon carbide chips, lots of brand-new packaging technologies and remedies for silicon carbide power components have arised recently.
Silicon carbide power module bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have actually created from gold cable bonding in 2001 to aluminum cable (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have developed from gold wires to copper wires, and the driving pressure is expense decrease; high-power devices have developed from aluminum cords (strips) to Cu Clips, and the driving force is to boost item performance. The greater the power, the higher the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that uses a solid copper bridge soldered to solder to attach chips and pins. Compared to conventional bonding packaging methods, Cu Clip technology has the following advantages:
1. The connection in between the chip and the pins is constructed from copper sheets, which, to a certain degree, replaces the typical cord bonding technique in between the chip and the pins. As a result, an unique bundle resistance value, greater existing circulation, and better thermal conductivity can be acquired.
2. The lead pin welding location does not require to be silver-plated, which can completely conserve the expense of silver plating and inadequate silver plating.
3. The product appearance is entirely regular with regular items and is primarily used in servers, mobile computers, batteries/drives, graphics cards, electric motors, power supplies, and other fields.
Cu Clip has two bonding approaches.
All copper sheet bonding method
Both eviction pad and the Resource pad are clip-based. This bonding approach is extra costly and intricate, but it can attain better Rdson and much better thermal impacts.
( copper strip)
Copper sheet plus cable bonding approach
The source pad utilizes a Clip approach, and eviction makes use of a Cable method. This bonding approach is a little more affordable than the all-copper bonding approach, saving wafer area (suitable to extremely little gate areas). The procedure is easier than the all-copper bonding method and can acquire better Rdson and much better thermal result.
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